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Tabular alumina for WCA series monocrystalline silicon wafer grinding
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Contacts：Director Ma
Tel：13938253542
Address：1105 science AvenueTabular alumina for WCA series monocrystalline silicon wafer grinding
Features: the crystal morphology is plate-shaped, smooth corner shape, not easy to produce scratches, narrow particle size distribution range, high hardness (Mohs hardness 9), strong grinding force, smooth material surface after grinding. It is a special abrasive for monocrystalline silicon wafer grinding in electronic industry, replacing imported and domestic production.
Purpose:
(1) Grinding and polishing of monocrystalline silicon wafer in electronic industry.
(2) Grinding and polishing of crystal wafer for electronic industry.
(3) Polishing of stainless steel tableware and other decorative materials.
(4) Polishing of mobile phone metal shell.
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