If the running speed of GPU (graphics card) determines the output capability of AI, then HBM is the key to determining the data processing speed and accuracy of GPU. HBM stands for High Bandwidth Memory. Currently, the mainstream stacked structure of HBM is to vertically stack common DRAM (Dynamic Memory) chips together and connect them through Through Silicon Via (TSV) technology, significantly increasing bandwidth and reducing volume. Due to the dense stacking of DRAM chips, the heat generated by high-speed operations is concentrated in a small space, making device heat dissipation the top challenge for hardware upgrades.

                                           GPU is referred to as the heart of AI in the industry
In March of this year, South Korean SK Hynix announced that it had provided customers with "12 layer HBM4" samples and planned to start mass production in the second half of the year. The packaging system uses an epoxy resin filler combination to solve the mechanical strength and heat dissipation problems of the device. As high bandwidth memory (HBM) technology evolves towards higher stacking layers (such as the 16 layers of HBM4) and larger bandwidth (1.2TB/s), the heat dissipation, signal integrity, and reliability of packaging materials will inevitably face more severe challenges.

The packaging material is between the chip and the substrate, and plays a role The function of heat dissipation and enhancing mechanical strength
Aluminum oxide is the main filler for electronic packaging that balances cost and performance. However, conventional spherical alumina has a high soft error rate due to the presence of alpha rays (alpha rays refer to uranium/thorium content, which can interfere with chips and cause data errors, especially in high-density packaging, where this problem becomes more prominent); Poor sphericity can lead to thermal mechanical failure (uneven filling, high porosity, and concentration of thermal mechanical stress); The mismatch of dielectric properties with high-frequency applications (Dk/Df parameters are directly related to signal delay and loss, which poses complex requirements for material design, surface modification, and process optimization) makes it difficult to meet the HBM packaging requirements. The Low - α - ray spherical alumina independently developed by Henan Tianma New Materials Co., Ltd. (Tianma New Materials) has solved the above pain points through four major technological breakthroughs:
1. Ultra low radioactivity: uranium/thorium content<5ppb;
2.  Sphericity: The melt state surface tension spheroidization process achieves high filling density and reduces viscosity;
3. High thermal conductivity: significant Risk of thermal runaway in 3D stacking;
4. Dielectric modulation: suppresses high-frequency signal loss.
Tianma New Materials relies on more than 20 years of research and production experience in high-end fine alumina powder materials, and develops higher performance fillers through optimized processes to assist Iteration of encapsulation technology. In 2025, the company will focus on promoting research and development innovation and capacity building, optimizing high-end materials such as low - α - ray spherical alumina, high-purity nano alumina, third-generation semiconductor packaging alumina, and high-purity alumina for ceramic films, and fully verifying the industrialization of innovative products. Strengthen R&D innovation investment and core technology research, lay out emerging fields, expand business boundaries, and develop more high-end products Industry development direction.
At the upcoming 9th Aluminum Oxide Powder and Product Innovation and Development Forum (April 24-25, 2025) in Zhengzhou, Ms. Ma Shuyun, Chairman of Tianma New Materials, will share a report titled "Development of Low - α Spherical Aluminum Oxide and Its Application in HBM Packaging Field", reporting the progress of key research and development projects to colleagues and partners in the industry, and contributing to the expansion of high-end and high value-added applications of domestic aluminum oxide!
Introduction of the reporter

Ms. Ma Shuyun, representative of the 14th People's Congress of Henan Province, Chairman and General Manager of Henan Tianma New Materials Co., Ltd. Graduated from Beijing University of Science and Technology, has been engaged in the development, research and application performance of fine alumina powder materials, crystal growth mechanism of fine alumina, and research on new materials such as high-purity nano alumina for a long time. Having personal inventions 7 items: "Special alpha alumina for electronic ceramic casting molding", etc. Participate in utility model 37 items: "Material airflow homogenization device", etc. Has successively won the Central Plains Technology Entrepreneurship Award Talent, one of the top ten figures in Henan's new economy, one of the top ten women entrepreneurs in science and technology in Henan Province, the second prize for scientific and technological progress in Henan Province, model worker in Zhengzhou, outstanding entrepreneurs in Zhengzhou, and growth entrepreneurs in the "Zhengzhou Entrepreneurs.. Plan".
In recent years, she has led the company to continuously develop new products, expand into new fields, and produce multiple products, All technical indicators have reached or exceeded the level of imported similar products. The company's multiple products have consistently ranked among the top in the domestic market share, among which "Aluminum Oxide for Electronic Ceramic Casting Chip Substrate" has received support from the Ministry of Science and Technology's Technology Innovation Fund for Small and Medium sized Enterprises, maintaining a domestic market share of over 80% for many years; Aluminum oxide for LCD substrate glass "has replaced imports and successfully supported the national" 863 Program - High Definition Flat Panel Display Technology Major Special Project "TFT-LCD Glass Substrate Technology Development and Engineering Technology Research" project. Its domestic market share has remained among the top three for many years; Led the enterprise to undertake one key project of the national key research and development plan, won one second prize for scientific and technological progress in Henan Province, and Award 1.
Building a high-end fine alumina material industry base is the development goal of the enterprise. Comrade Ma Shuyun will continue to lead enterprises to increase the industrial operation of scientific research projects through the research and development of new technologies, accelerate the deep integration with emerging industries, and drive the advantageous industries of aluminum based new materials, downstream strategic new industries, and regional development in Henan Province while achieving the leapfrog development of Tianma New Materials The material industry chain has entered a stage of rapid development, contributing to the high-quality development of the industry.